Ie3d simulator

IE3D-SI scalable computing architecture leverages your multi-core computers and server farms to solve the largest packaging problems with the fastest turnaround ensuring a fully optimized design where all end cases have been investigated prior to final tape out. Sonnet can model embedded dielectric or metal bodies that have a constant cross-section through any dielectric layer, like holes, gaps or truncated capacitor dielectrics. EM Simulator or Circuit Simulator? IE3D-SI delivers the most accurate models of packages housing stacked die, multiple die, and embedded passives with multi-height bond wires, solder balls, bumps, vias, and through silicon vias.

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IE3D - Scalable EM Simulation Solution

They claim to be able to do 3D bodies, but they are limited to rather simple bodies. Sonnet can model embedded dielectric or metal bodies that have a constant cross-section through any dielectric layer, like holes, gaps or truncated capacitor dielectrics.

Company Profile Simulatpr Us. With multi-CPUs, you can finish your jobs much sooner in higher quality. Circuit-level EM simulation captures the true electrical behavior of a designs passive structures including coupling. Contact Jian Zheng, Ph.

IE3D's multi-threaded and distributed simulation architecture and high-design capacity is the most cost-effective EM simulation and modeling solution for component-level and circuit-level applications. Services Bookstore Press Release Service. Contact Jian Zheng, Ph.

Zeland IE3D Version 12.12 Features RFID Antenna Design Tools

IE3DLibrary is further improved. Company Profile Email Us. Phase and level monitor of two signals Lumped element equivalent circuits are simulatir for modern RFIC designs and signal integrity.

Momentum cannot model embedded bodies dielectricsso it is the most restricted in this respect. I may be overly general with that statement, but that's usually the way I think of it. Losses in inductor of a boost converter Getting the array unit cell right from the start is essential before replicating into a larger antenna array structure. IE3D-SI scalable computing architecture leverages your multi-core computers and server farms to solve the largest packaging problems with the fastest turnaround ensuring a fully optimized design where all end cases have been investigated prior to final tape out.

HDL simulation help to understand the function of verilog file 7. Sonnet models planar structures in a shielded environment.

But if your bodies are even moderately complex, you will be better off with a full 3D EM simulator, because these planar simulators become very inefficient when you need accurate modeling of 3D bodies. Momentum is limited to planar structures only. Click Here To Download: What do you think about IE3D Zeland simulator?

Is IE3D a 3D EM simulator?

Now full 3D geometry modeling of bond wires, via structures, and other 3D structures are a must-have for designers pushing performance. And ensuring the target layout will indeed meet the overall design objectives including a correct conjugate match is often a lengthy trial and error process.

IE3D-SI is the perfect answer for the circuit design and signal integrity engineer delivering the fastest throughput and capacity of any true 3D EM simulation commercially available. I agree to the Terms and Privacy Statement.

I have seen a Sonnet model for a microstrip-coupled dielectric puck resonator that showed a fundamental resonance within 0. Increasing operating frequencies and the rapid move to multi-chip system architectures have sparking a new parasitic extraction paradigm shift for IC packaging that now requires the accuracy of full 3D EM simulation and modeling.

But you would realistically use these 3D MoM tools for scattering problems and full 3D structures like radar cross-section analysis of a full airframe that are electrically too large for volume meshing approaches, I think.

I agree to the Terms and Privacy Statement. IE3D-SI delivers the most accurate models of packages housing stacked die, multiple die, and embedded passives with multi-height bond wires, solder balls, bumps, vias, and through silicon vias.

VHDL compilation error "Identifier "unsigned" is not directly visible" 1. Package models built upon simplistic 2D approximations simjlator no longer be relied upon to secure successful design closure.

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